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Soldering Profile

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SCHURTER components for printed circuit boards are suitable for common solder processes. THT components can be wave soldered with a peak temperature of 230 to 260°C. SMD components are suitable for reflow soldering with a peak temperature of 260°C.

Please note the soldering specification on the product data sheet.

Recommended Wave Soldering Profile

The solder temperature 230°C – 260°C depends on the solder classification of the components.

Recomended Reflow Soldering Profile

Soldering Profile:

Reflow feature

Pb-free assembly


Min. 150°C


Max. 200°C


Time (Min. - Max.) 60-120 secs

Ramp-up rate (TL to Tp)

3°C / secs max.

Liquidous temperature (TL)


Time (tL) maintained above (TL)

60 - 150 secs

Time (tP) below 5°C of max. peak temperature

30 secs max.

Ramp-down rate (TP to TL)

6°C / secs max.

Time 25°C to peak temperature

8 mins max.

Peak temperature maximum


* The peak temperature depends also on the component volume (see JEDEC J-STD-020D)

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