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Soldering Profile
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SCHURTER components for printed circuit boards are suitable for common solder processes. THT components can be wave soldered with a peak temperature of 230 to 260°C. SMD components are suitable for reflow soldering with a peak temperature of 260°C.
Please note the soldering specification on the product data sheet.
Recommended Wave Soldering Profile
The solder temperature 230°C – 260°C depends on the solder classification of the components.
Recomended Reflow Soldering Profile
Soldering Profile:
Reflow feature
Pb-free assembly
Preheat
Min. 150°C
Preheat
Max. 200°C
Preheat
Time (Min. - Max.) 60-120 secs
Ramp-up rate (TL to Tp)
3°C / secs max.
Liquidous temperature (TL)
217°C
Time (tL) maintained above (TL)
60 - 150 secs
Time (tP) below 5°C of max. peak temperature
30 secs max.
Ramp-down rate (TP to TL)
6°C / secs max.
Time 25°C to peak temperature
8 mins max.
Peak temperature maximum
260°C
* The peak temperature depends also on the component volume (see JEDEC J-STD-020D)
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